Encapsulation method and encapsulation device
US10300688B2 · kind B2 · utility
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Key dates
| Filing date | Aug 10, 2016 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | May 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/568
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An encapsulation method and an encapsulation device are provided. The encapsulation method comprises: forming a binding agent in an encapsulation region of a display substrate; forming an organic thin film on the binding agent; exerting a pressure on the organic thin film and the binding agent by using a pressure exerting device, wherein the organic thin film is not bound to the pressure exerting device; removing the organic thin film; and providing a cover plate on the binding agent and binding the cover plate with the display substrate by the binding agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.