Resin composition, molded product, and plumbing mechanical component
US10301466B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 25, 2016 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Jul 3, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a resin composition including: a resin mixture (a) containing a polyphenylene ether resin and atactic homopolystyrene in an amount of above 50 mass % and below 94 mass %; a hydrogenated block copolymer (b) obtained by hydrogenating at least part of a block copolymer containing polymer blocks A and B in an amount of 1 to 20 mass %; a functional group-containing compound (c) having a specific functional group in an amount of 0.01 to 0.5 mass %; and a surface-treated inorganic filler (d) in an amount of 5 mass % or more and less than 30 mass %, in which the resin composition does not substantially contain a polymer having a hydrogenation ratio of less than 98% in a conjugated diene compound portion, the component (a-1) has a weight average molecular weight of less than 70,000, and the component (b) has a number average molecular weight of 150,000 to 300,000.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.