Support structure for lighting devices, corresponding lighting device and method
US10302282B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2017 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Dec 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A support structure for electrically-powered lighting devices (e.g. LED modules) includes: an elongated laminar substrate having first and second mutually opposed surfaces, a layer of electrically-conductive material, e.g. copper, on the first surface of the laminar substrate, the layer including etching forming first electrically-conductive formations extending along the first surface of the laminar substrate, a distribution of electrically-conductive areas on the second surface of the laminar substrate, the distribution including electrically-conductive areas formed by means of etching and distributed with a constant separation pitch along the second surface of the laminar substrate, electrically-conductive vias extending through the laminar substrate to connect the first electrically-conductive formations and the electrically-conductive areas in said distribution, and a network of second electrically-conductive formations including electrically-conductive ink deposited (e.g. printed) on the second surface of the laminar substrate, with second electrically-conductive formations in said network being electrically connected with the electrically-conductive areas in said distributio…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.