Heat exchanger apparatus with manifold cooling
US10302365B2 · kind B2 · utility
0Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2014 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Jun 20, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2265/10
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Disclosed is a heat exchanger having heat exchange plates and a base plate that can help to mitigate the thermal stresses encountered by a heat exchanger, particularly, around the peripheral edge portions of the heat exchanger and the base of heat exchanger. This is achieved by providing a channel of coolant fluid near the peripheral edge portions which is in between the peripheral edge portions and the manifold permitting flow of hot fluid. In addition, the base plate of the heat exchanger is protected from the hot fluid flowing through the manifold by providing deflectors that shield the base plate from the hot fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.