Photosensitive resin composition, photosensitive resin layer using the same and display device
US10303054B2 · kind B2 · utility
1Cited by
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14Claims
0Family size
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Key dates
| Filing date | Jan 17, 2017 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Jan 30, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/70
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition includes a binder resin, a black colorant, a photopolymerizable monomer, a photopolymerization initiator, and a solvent. The binder resin includes a first binder resin having a glass transition temperature of about −50° C. to about 150° C. and a second binder resin having a glass transition temperature of greater than about 150° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.