Cooler for use in a device in a vacuum
US10303067B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2016 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | May 10, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2265/16
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The disclosure relates to a cooler for use in a device in a vacuum, wherein the partial pressure of the cooling medium in the vacuum environment during the operation of the cooler is less than 10−3 mbar. The cooler includes a heat sink, wherein a cavity through which the cooling medium flows is formed in the heat sink, and wherein the heat sink includes a connection element which surrounds one end of the cavity through which the cooling medium flows. The cooler also includes a connecting piece for joining a coolant line to the cavity. The connecting piece includes a jacket secured on the connection element by a thermal connecting process. An intermediate layer is between the jacket and the connection element. The jacket exerts a force in the direction of the connection element so that the intermediate layer is under compressive stress in the radial direction during operation of the cooler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.