Imaging sensor and imaging module
US10303918B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2017 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Jun 9, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8037
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Imaging sensor and imaging module are provided. The imaging sensor includes: a substrate; multiple pixel units disposed on the substrate, configured to acquire an optical signal carrying imaging information and convert the optical signal into an electric pixel signal, and arranged in array to form a pixel array; multiple bias voltage pseudo pixel units disposed around the pixel array, connected with the pixel units, and configured to provide a bias voltage to the pixel units; and at least one touch sensing pseudo pixel unit disposed at one side of the bias voltage pseudo pixel units which is away from the pixel units, and configured to form a capacitor structure to sense a touch to form an electric touch signal. Color aberration between the bias voltage pseudo pixel units and the touch sensing pseudo pixel unit and the pixel units is reduced, and appearance of the imaging sensor is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.