Fabrication methods and modal stiffining for non-flat single/multi-piece emitter
US10304652B2 · kind B2 · utility
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2References
10Claims
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Key dates
| Filing date | May 18, 2018 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | May 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05G1/02
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electron emitter assembly includes a plurality of electron emitters, and a removable structure connected to, and fixing a positional relationship among, individual ones of the plurality of electron emitters. A method of assembling an electron emitter assembly includes connecting individual ones of a plurality of electron emitters together with a removable structure, and fixing a positional relationship among the individual ones of the plurality of electron emitters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.