Semiconductor device with stacked terminals
US10304770B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2018 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Feb 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13055
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes housing, a substrate, a first semiconductor die, a second semiconductor die, a first terminal, and a second terminal. The first terminal in a first terminal plane couples to the first semiconductor die. The second terminal has a contact portion in a contact portion plane within the housing that couples to the second semiconductor die, a main portion in a main portion plane partially within the housing, the main portion plane substantially parallel to and offset from the first terminal plane, and the main portion plane substantially parallel to and offset from the contact portion plane, and an offsetting portion within the housing and that connects the contact portion to the main portion. At least some of the main portion of the second terminal overlaps the first terminal and the first terminal and the main portion of the second terminal extend from the housing in a same direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.