DDR electronic module assembly
US10306751B2 · kind B2 · utility
0Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2017 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Oct 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module assembly has a memory module that includes a memory module and an electronic module. The memory module includes a first board having a first board first surface disposed opposite a first board second surface. The electronic module is operatively connected to the memory module. The electronic module includes a mounting plate having a mounting plate first surface that is disposed opposite a mounting plate second surface that faces towards the first board first surface. The mounting plate has a first post and a second post spaced apart from the first post.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.