Laser fiber array for singulating semiconductor wafers
US10307867B2 · kind B2 · utility
1Cited by
11References
11Claims
0Family size
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Key dates
| Filing date | Nov 5, 2014 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Jun 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67092
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for cutting a substrate comprises first and second lasers, and first and second optical fibers each having an input end and an output end opposite to the input end, wherein the input ends of the first and second optical fibers are connected to the first and second lasers respectively. The output ends of the first and second optical fibers are movable relative to the substrate and are configured to image first and second laser beams onto the substrate simultaneously for cutting the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.