Patent · US Active

Hot stamping method

US10307937B2 · kind B2 · utility

1Cited by

9References

9Claims

0Family size

Assignee

Sartorius Stedim Biotech GmbH · DE

Inventors

Thomas Regen · Göttingen, DE
Sebastian Purmann · Göttingen, DE
Nikoloudis Paschalis · Oettingen, DE
Christian Grimm · Heilbad Heiligenstadt, DE

Key dates

Filing date	Dec 4, 2013
Grant date	Jun 4, 2019
Priority date	—
Expiry date	May 14, 2035

Classification

Technology area (CPC E)Fixed Constructions
CPC primaryE04B2001/8452
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A method for implementing a channel (56) includes providing a preform (20) having a recess (22) therein and heating a channel implementation element (30′) to a temperature greater than a melting temperature of a material of the preform (20). An external contour of the channel implementation element (30′) at least regionally corresponds to an internal contour of the channel (56) to be implemented. The method then moves the heated channel implementation and/or the preform (20) in relation to one another so that the heated channel implementation element (56) at least regionally moves into the recess (22) in a moving-in direction. The material of the preform (20) is at least partially melted in a region around the recess (20) and is at least partially displaced by the channel implementation element (30′), wherein at least a part of the channel (56) to be implemented is thus implemented.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.