Composite board composed of wood material
US10307994B2 · kind B2 · utility
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2References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 17, 2015 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Dec 19, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2307/734
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composite board composed of wood material with a middle layer (4) made of chipboard, wherein the middle layer is connected to at least one outer layer (2, 6) composed of fiberboard, wherein an artificial-resin-impregnated paper (3, 5 ) is arranged between the middle layer and the outer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.