Multilayer ceramic substrate and electronic component
US10308546B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 23, 2018 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | May 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/068
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A multilayer ceramic substrate that includes a laminated structure including a surface layer portion located on a surface of the laminated structure and an inner layer portion located on the inner side of the laminated structure, the surface layer portion including a first layer adjacent to the inner layer portion, the inner layer portion including a second layer adjacent to the first layer. The thermal expansion coefficient of the first layer is lower than the thermal expansion coefficient of the second layer, a first glass contained in the first layer and a second glass contained in the second layer each contain 40% or more by weight MO (where M represents at least one selected from the group consisting of Ca, Mg, Sr, and Ba), and the difference in softening points between the first glass and the second glass is 60° C. or lower.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.