Patent · US Active

Pastes for thermal, electrical and mechanical bonding

US10308856B1 · kind B1 · utility

8Cited by

42References

20Claims

0Family size

Assignee

The Research Foundation for The State University of New York · US

Inventors

Hao Wang · Hefei, CN
Bahgat Sammakia · Newark Valley, US

Key dates

Filing date	Mar 14, 2014
Grant date	Jun 4, 2019
Priority date	—
Expiry date	Jan 4, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01B1/02
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A class of paste materials for thermal, and mechanical bonding, and in some cases electrical interconnection, of two solid surfaces includes particles and an organic vehicle which is partially or completely removed during processing. The paste includes hybrids of inorganic materials for meeting the thermal, electrical and mechanical bonding functionality requirements and organic materials for meeting the process, application and protection requirements. The inorganic materials include high thermal and optionally electrical conductivity materials in forms from nanoparticles to micro-powders. The organic materials may include small molecules, surfactant, oligomers, and polymers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.