Apparatus for sputtering and operation method thereof
US10309007B2 · kind B2 · utility
0Cited by
4References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 11, 2015 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Jul 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2855
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Some embodiments of the present disclosure provide a sputtering apparatus including a magnetron structure configured to erode a target according to a predetermined erosion rate profile symmetric to a central axis of the magnetron structure. The predetermined erosion rate profile includes a first peak rate in proximity to the central axis; and a second peak rate located at about from 0.7 to 0.75 of a radius of the target from the central axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.