Titanium-based thermal ground plane
US10309728B2 · kind B2 · utility
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5References
13Claims
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Key dates
| Filing date | Jul 22, 2014 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | May 2, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.