Temperature-controlled module for electronic devices and testing apparatus provided with the same
US10309986B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2017 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Aug 31, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05D23/24
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A temperature-controlled module for electronic devices and a testing apparatus provided with the same mainly include a temperature-controlled tray, an upper board and a dry-air supply device. The temperature-controlled tray includes holding cavities for accommodating electronic devices and a fluid chamber for cooling fluid. The upper board is furnished with through holes, while the upper board and the temperature-controlled tray are spaced by a predetermined distance. The dry-air supply device provides dry air to a space between the temperature-controlled tray and the upper board. Thereupon, by having cooling fluid to flow inside the temperature-controlled tray, the temperature-controlled tray can be kept in a lower predetermined temperature so as to rapidly cool down the electronic device. In addition, by providing the upper board and the dry-air supply device to allow dry air to flow through the surface of the electronic device, then the water-condensation phenomenon and air leakage can avoided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.