Wafer scale test interface unit and contactors
US10310009B2 · kind B2 · utility
1Cited by
206References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2015 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Jan 16, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07357
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Devices and methods for multilayer packages, antenna array feeds, test interface units, connectors, contactors, and large format substrates. The device comprising a 3D coaxial distribution network structure including a plurality of coaxial transmission lines separated by a first pitch at the input and a second, wider pitch at the output thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.