Method of producing layer structure, layer structure, and method of forming patterns
US10312074B2 · kind B2 · utility
1Cited by
2References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2015 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Oct 26, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2261/90
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method of producing a layer structure includes forming a first organic layer by applying a first composition including an organic compound on a substrate having a plurality of patterns, applying a solvent on the first organic layer to remove a part of the first organic layer, and applying a second composition including an organic compound on a remaining part of the first organic layer and forming a second organic layer through a curing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.