Protective tape and method for manufacturing semiconductor device using the same
US10312125B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2016 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Jun 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83191
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A protective tape that improves solder bonding properties and reduces wafer warping. The protective tape includes, in the following order, an adhesive agent layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a matrix film layer. The protective tape satisfies the conditions expressed by the following formulae (1) to (3): Ga>Gb (1)Ta<Tb (2)(Ga*Ta+Gb*Tb)/(Ta+Tb)≤1.4E+06 Pa. (3) Ga represents a shear storage modulus of the first thermoplastic resin layer at a pasting temperature at which the protective tape is pasted; Gb represents a shear storage modulus of the second thermoplastic resin layer at the pasting temperature at which the protective tape is pasted; Ta represents a thickness of the first thermoplastic resin layer; and Tb represents a thickness of the second thermoplastic resin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.