Thermal interface materials including a coloring agent

US10312177B2 · kind B2 · utility

Assignee

• HONEYWELL INTERNATIONAL INC. · US

Inventors

• Liqiang Zhang · Shandong, CN
• Yaqin Mao · Shanghai, CN
• Huifeng Duan · Shanghai, CN
• Haigang Kang · Shanghai, CN
• Ya Qun Liu · Shanghai, CN
• Ling Shen · Shanghai, CN
• Kai Zhang · Shanghai, CN

Key dates

• Filing date: Oct 12, 2016
• Grant date: Jun 4, 2019
• Expiry date: Oct 12, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/3737
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.