Atomization mechanism for cooling a bond head
US10312214B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Sep 8, 2016 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Jul 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/75901
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.