Flexible electronic assembly with semiconductor die
US10312415B2 · kind B2 · utility
1Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2017 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Jun 19, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/819
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic assembly comprises a flexible polymer membrane having a surface with one or more electrically conductive traces arranged on the surface, a light-emissive semiconductor die having first and second electrical contacts bonded to the one or more electrically conductive traces via a cured electrically conductive adhesive, and a flexible cover layer arranged over the surface of the polymer membrane and the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.