Printed circuit board heat dissipation system using highly conductive heat dissipation pad
US10314159B2 · kind B2 · utility
0Cited by
12References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2016 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Dec 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention presents a printed circuit board heat dissipation system using a highly conductive heat dissipation pad, the heat dissipation system comprising: one or more electronic components mounted on a printed circuit board; the printed circuit board having formed thereon a conductive pattern providing current paths between the mounted one or more electronic components; and a highly conductive heat dissipation pad discharging heat generated due to the current flowing in the conductive pattern of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.