Package module
US10314178B2 · kind B2 · utility
0Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2018 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Sep 27, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.