Transfer for application to a surface
US10315402B2 · kind B2 · utility
5Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2016 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Feb 3, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/109
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductive transfer for application to a surface is described. The conductive transfer comprises first and second non-conductive ink layers and an electrically conductive layer positioned between the first and second non-conductive ink layers. The conductive transfer also includes an adhesive layer for adhering the conductive transfer to the surface of an article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.