Bonding of composite materials
US10315404B2 · kind B2 · utility
0Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2017 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Dec 8, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/008
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.