Method of producing structure and method of producing liquid discharge head
US10315425B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2017 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Jun 14, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14467
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Provided is a method of producing a structure including a substrate having openings in a first surface and a lid structure formed on the first surface and having an opening portion communicating with a part of the openings. The method includes preparing a laminate by forming a layer containing a photosensitive resin composition on a base film, stacking the laminate on the first surface such that the first surface is in contact with the photosensitive resin composition-containing layer, and forming a pattern for the opening portion of the lid structure in the photosensitive resin composition-containing layer by pattern exposure of the layer through the base film. The maximum scattering light intensity of the base film at a scattering angle of 10° or more is 1/100000 or less of the light intensity at a scattering angle of 0°, at a wavelength of 400 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.