Patent · US Active

Microelectromechanical system microphone

US10315912B2 · kind B2 · utility

4Cited by
15References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 22, 2017
Grant dateJun 11, 2019
Priority date
Expiry dateDec 22, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH04R2410/00
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

A microelectromechanical system (MEMS) includes a diaphragm with a first surface and a second surface. The first surface is exposed to an environmental pressure. The second surface comprises a plurality of fingers extending from the second surface. The MEMS also includes a backplate comprising a plurality of voids. Each of the plurality of fingers extends into a respective one of the plurality of voids. The MEMS further includes an insulator between a portion of the diaphragm and a portion of the backplate. The diaphragm is configured to move with respect to the backplate in response to changes in the environmental pressure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.