Dual-cure resins and related methods
US10316213B1 · kind B1 · utility
14Cited by
106References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2017 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | May 1, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D175/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present disclosure relates generally to curable resins, in particular dual-cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.