Composition for forming silica layer, and silica layer
US10316216B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Apr 4, 2017 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Apr 4, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1245
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composition for forming a silica layer, a silica layer, and an electronic device, the composition including a silicon-containing polymer; and a solvent, wherein a 1H-NMR spectrum of the silicon-containing polymer satisfies Equations 1 and 2: B/A=0.2 to 0.4 [Equation 1](A+B)/C=4.8 to 12.0. [Equation 2]
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.