Patent · US Active

Assembly of a semi-conductor lamp from separately produced components

US10317061B2 · kind B2 · utility

1Cited by

1References

20Claims

0Family size

Assignee

LEDVANCE GMBH · DE

Inventors

Thomas Klafta · Maxhütte-Haidhof, DE
Hubertus Breier · Herbrechtingen, DE
Michael Rosenauer · Regensburg, DE
Marianne Auernhammer · Monheim, DE

Key dates

Filing date	Nov 9, 2018
Grant date	Jun 11, 2019
Priority date	—
Expiry date	Nov 9, 2038

Classification

Technology area (CPC F)Mechanical Engineering; Lighting; Heating
CPC primaryF21Y2115/10
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Various embodiments may relate to a semiconductor lamp having at least one semiconductor light source, including multiple separately produced components, wherein at least two of the components are connected to one another by means of joint extrusion coating. Various embodiments further relate to a method for producing a semiconductor lamp having at least one semiconductor light source. The method includes at least, inserting at least one open driver housing and a cover for the driver housing into an injection mold, and extrusion coating the components inserted into the mold using potting material so that these components are permanently connected to one another by the potting material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.