Patent · US Active

Robust inertial sensors

US10317211B2 · kind B2 · utility

3Cited by

8References

11Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Bongsang Kim · Mountain View, US
Ando Feyh · Palo Alto, US
Andrew Graham · Redwood City, US
Gary O'Brien · Palo Alto, US
Michael Baus · Bietigheim-Bissingen, DE
Ralf Maier · Neuendorf, DE
Mariusz Koc · Stuttgart, DE

Key dates

Filing date	Dec 30, 2014
Grant date	Jun 11, 2019
Priority date	—
Expiry date	Apr 9, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/16152
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

In one embodiment, a sensor includes a rigid wafer outer body. A first cavity is located within the rigid wafer outer body, and a first vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity. A second vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity, and a first sensor packaging is supported by the first vibration isolating spring and the second vibration isolating spring within the first cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.