Gas sensor packaging including structure to maintain devices in a state of readiness
US10317382B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2014 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Jul 22, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Packaging for electronic components includes provisions to short selected electrodes of the components together. A plastic base portion with a plurality of component receiving cavities carries a flexible, carbonized shorting element which extends between cavities. The cavities include a recess which is adjacent to the shorting element. Components can be inserted into respective cavities, and some of the electrodes will contact the shorting element. Other electrodes will extend into the recess and not be shorted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.