Modular multi-function thermostat
US10318266B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2016 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | May 2, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/2642
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermostat includes a motherboard, a first modular board, and a display. The motherboard is configured to perform a thermostat function and generate a user interface a user interface including information relating to the thermostat function. The first modular board is configured to be added to the thermostat by coupling the first modular board to the motherboard and to be removed from the thermostat by decoupling the first modular board from the motherboard. The first modular board is configured to supplement the thermostat function performed by the motherboard when the first modular board is coupled to the motherboard. The display is communicably coupled to the motherboard. The display is configured to display the user interface. The motherboard is configured to adaptively reconfigure the user interface to include supplemental information provided by the first modular board in response to coupling of the first modular board to the motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.