Metal recycling method and metal recycling equipment thereof
US10319618B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Sep 26, 2016 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Jan 24, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB44C1/14
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metal recycling method comprises attaching a tape to a metal layer of a semiconductor structure; and separating a part of the metal layer from the semiconductor structure and transferring the part of the metal layer to the tape by a pressure difference.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.