Micro-LED module and method for fabricating the same
US10319706B2 · kind B2 · utility
6Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2017 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Nov 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/142
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.