Method for producing an optoelectronic component and an optoelectronic component

US10319789B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Darshan Kundaliya · Beverly, US
• David O'Brien · Portland, US
• Britta Göötz · Regensburg, DE

Key dates

• Filing date: Aug 12, 2016
• Grant date: Jun 11, 2019
• Expiry date: Jul 12, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/80

Abstract

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In embodiments, the method includes A) providing an auxiliary carrier; B) applying a sacrificial layer on the auxiliary carrier; C) applying a converter layer on the sacrificial layer, which includes quantum dots embedded in a matrix material or a luminescent polymer; D) providing a semiconductor layer sequence; E) optionally applying an adhesive layer on the semiconductor layer sequence; F) optionally bonding the converter layer on the semiconductor layer sequence by means of an adhesive layer, wherein the semiconductor layer sequence is configured to emit radiation; and G) removing the auxiliary carrier by means of optical, mechanical and/or chemical treatment and at least partially destroying the sacrificial layer.