Method for manufacturing a display substrate by peeling an organic layer
US10319793B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2016 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Aug 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/122
Abstract
The present disclosure discloses a method for manufacturing a display substrate, including: forming an organic thin film layer by coating a conductive organic material on a base substrate at a region which corresponds to a non-display region of a to-be-formed display substrate; forming a pixel definition layer on the base substrate; printing an organic functional layer within a pixel region defined by the pixel definition layer on the base substrate; and removing the organic functional layer at the non-display region by peeling off the organic thin film layer. The peeling off the organic thin film layer includes: connecting two ends of the organic thin film layer to two electrodes of a power supply, respectively; and breaking an interface between the organic thin film layer and the pixel definition layer with joule heat generated by the organic thin film layer when the organic thin film layer is powered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.