Device attachment with infrared imaging sensor

US10321031B2 · kind B2 · utility

Assignee

• FLIR Systems, Inc. · US

Inventors

• Jeffrey D. Frank · Redmond, US
• Nicholas Högasten · Lompoc, US
• Theodore R. Hoelter · Goleta, US
• Katrin Strandemar · Rimbo, SE
• Pierre Boulanger · Goleta, US
• Barbara Sharp · Lompoc, US
• Andrew C. Teich · West Linn, US
• Dwight Dumpert · Goleta, US
• Mark Nussmeier · Goleta, US
• Eric A. Kurth · Lompoc, US
• Gerald W. Blakeley, III · Lincoln, US
• Michael Fox · Fitchburg, US

Key dates

• Filing date: Feb 16, 2018
• Grant date: Jun 11, 2019
• Expiry date: Feb 16, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04N25/76
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.