Display device and method for detecting bonding condition in bonding area of display device
US10321559B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2016 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Jun 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The display device comprises a printed circuit board, a display panel and a chip on film for connecting the printed circuit board with the display panel. The chip on film comprises a plurality of output pads and a plurality of first test pads which are close to the plurality of output pads and arranged at intervals. The display panel comprises a plurality of input pads in one-to-one correspondence with the plurality of output pads of the chip on film, and a plurality of second test pads which are close to the plurality of input pads of the display panel and arranged at intervals. A gap between two adjacent first test pads of the chip on film overlaps a second test pad of the display panel such that the two adjacent first test pads of the chip on film are connected via the second test pad of the display panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.