Flexible circuit board, COF module and electronic device comprising the same
US10321562B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2017 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Jul 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.