Electronic module and method of making same
US10321569B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2016 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Sep 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0715
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic module with all-sided electromagnetic interference (EMI) shielding and methods of making same. The electronic module includes an encapsulated circuit board between a top plate and a conductive bottom plate, electrical leads extending from the circuit board through the bottom plate, and a continuous conductive coating substantially covering the entire electronic module except for a bottom surface of the bottom plate. The conductive coating forms direct, independent connections at least to the circuit board and the bottom plate. The conductive coating provides EMI shielding across the top and sides of the electronic module. The conductive bottom plate provides EMI shielding across the bottom of the electronic module. Methods of manufacturing include encapsulating a circuit board between a top plate and bottom plate, separating materials from the encapsulated circuit board to expose conductive traces on the circuit board and bottom plate, and coating the sawed device with a conductive coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.