Bonded member manufacturing apparatus and method of manufacturing bonded member
US10322547B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2016 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Mar 9, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1798
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
To prevent misalignment between substrates and distortion of surface, and to keep film thickness uniformity of thin substrate when two substrates are bonded for bonded member, bonded member manufacturing apparatus of bonding first substrate and second substrate, comprising resin film forming means for forming liquid state resin film on the first substrate, semi-curing means for maintaining outer peripheral section of resin film in uncured state and curing inner section surrounded with outer peripheral section in semi-cured state, and substrate bonding means for bonding first substrate and second substrate by bringing second substrate into contact with resin film, such that one end of outer peripheral section is determined as starting point of contact so that boundary line between contact portion and noncontact portion moves in one direction from starting point to opposite end of outer peripheral section while applying pressing force to second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.