Patent · US Active

Laminate material bonding

US10322570B2 · kind B2 · utility

0Cited by
7References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 20, 2017
Grant dateJun 18, 2019
Priority date
Expiry dateNov 20, 2037

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB32B2457/00
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Systems and techniques are provided for laminate material bonding. A bonding agent may be applied to a first layer. A second layer may be placed onto the bonding agent on the first layer to form a laminate material. The laminate material may be placed between a first piece of non-compliant material with a first piece of compliant material and a second piece of non-compliant material with a second piece of compliant material. The laminate material may be in contact with the first piece non-compliant material and the second piece of non-compliant material. Pressure may be applied to the laminate material by applying pressure to the first piece of compliant material for a curing time of the bonding agent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.