Methods and systems for monitoring a non-defect related characteristic of a patterned wafer
US10324046B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2016 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Apr 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems for monitoring a non-defect related characteristic of a patterned wafer are provided. One computer-implemented method includes generating output responsive to light from a patterned wafer using an inspection system. The method also includes determining differences between a value of a non-defect related characteristic of the patterned wafer and a known value of the non-defect related characteristic based on differences between one or more attributes of the output and one or more attributes of other output of the inspection system for a different patterned wafer having the known value of the non-defect related characteristic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.