Patent · US Active

Multi-port optical probe for photonic IC characterization and packaging

US10324261B2 · kind B2 · utility

8Cited by

8References

17Claims

0Family size

Assignee

Technische Universiteit Eindhoven · NL

Inventors

Xaverius Jacques Maria Leijtens · Eindhoven, NL
Rui Manuel Lemos Álvares dos Santos · Eindhoven, NL

Key dates

Filing date	Feb 18, 2016
Grant date	Jun 18, 2019
Priority date	—
Expiry date	Feb 18, 2036

Classification

Technology area (CPC G)Physics
CPC primaryG02B6/368
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Improved passive optical coupling to photonic integrated circuit (PIC) chips is provided. An interposer unit (108) having one or more flexible optical waveguide members (112, 114, 116) is employed. The flexible optical waveguide members are coupled to the PIC chip (118) via their tips. The PIC chip includes alignment features to facilitate lateral, vertical and longitudinal passive alignment of the flexible optical waveguide members to on-chip optical waveguides of the PIC.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.