Heat dissipation assembly and electronic device using the same
US10324505B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2017 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Apr 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4006
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation assembly includes a pressing unit and a heat dissipation module. The pressing unit includes a pressing plate, a plurality of elastic cantilevers and contacting members. The pressing plate can be secured on a bottom plate so that a heat source can be sandwiched between the pressing plate and the bottom plate. The elastic cantilevers are respectively disposed on the pressing plate and protruded outwards from the pressing plate to be suspended in midair. The contacting members are respectively disposed on the elastic cantilevers for abutting the bottom plate. The heat dissipation module is fixedly connected to the pressing plate and a carrier member for thermally guiding the heat source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.