Thermal management apparatus
US10324506B2 · kind B2 · utility
0Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2015 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Jun 5, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20145
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In the examples provided herein, an apparatus has modules to be cooled during operation, where each module is coupled to a heatsink, and the heatsinks are coupled to a first surface of a thermally conductive plate. The modules are positioned along a direction from a first side of the plate toward an opposite side of the plate. The apparatus also has heat pipes coupled to a second surface of the plate to transport heat away from the modules during operation, where the heat pipes are positioned nonuniformly along the direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.